American Journal of Applied Sciences

Numerical Simulation of Micro-Channel Heat Sink with Dimpled Surfaces

Suabsakul Gururatana

DOI : 10.3844/ajassp.2012.399.404

American Journal of Applied Sciences

Volume 9, Issue 3

Pages 399-404


Problem statement: The power density of electronic devices has been increasing along with the rapid technology development. Cooling off electronic systems is essential in controlling the component temperature and avoiding any hot spot. The micro-devices are now extensively used in electronic application especially for cooling the computer chip. Approach: Micro-channel heat sinks are adopted in electronics cooling together with different technologies to enhance the heat transfer process. To improve the cooling process in heat sink, dimples are used because they are simple and cheap technologies. Therefore, this study aims to investigate the micro-channel heat sink with dimples. Results: The heat transfer enhancement in micro-channel heat sink using dimples is useful when the Reynolds number is greater than 125. Conclusion: The results of this study can help designing micro-channel heat sinks for electronics cooling by employing the concept of dimples.


© 2012 Suabsakul Gururatana. This is an open access article distributed under the terms of the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original author and source are credited.