@article {10.3844/ajeassp.2010.83.89,
article_type = {journal},
title = {Comparative Study of Different Underfill Material on Flip Chip Ceramic Ball Grid Array Based on Accelerated Thermal Cycling},
author = {Kornain, Z. and Jalar, A. and Amin, N. and Rasid, R. and Foong, C. S.},
volume = {3},
number = {1},
year = {2010},
month = {Mar},
pages = {83-89},
doi = {10.3844/ajeassp.2010.83.89},
url = {https://thescipub.com/abstract/ajeassp.2010.83.89},
abstract = {Problem statement:  This study mainly to study the effect of several commercial underfill materials to the reliability of HiCTE Flip Chip Ceramic Ball Grid Array (FC-CBGA) package due to Accelerated Thermal Cycling (ATC) effect. Approach: The warpage condition of package, die back stress, interfacial die shear stress, and solder bump fatigue for different commercial underfills were assessed and compared via a commercial Finite Element Analysis (FEA) under JEDEC Standard of ATC. The thermo-mechanical properties of underfills for simulation were obtained by using Thermal Mechanical Analyzer (TMA) and Dynamic Mechanical Analyzer (DMA). The actual package of HiCTE FC-CBGA were assembled with those underfill materials and underwent ATC to be compared with FEA result. Results: The results from FEA and experimental were discussed to characterize the performance of each underfill material. The results of this study indicate that the underfill materials investigated, those with a glass transition temperature (Tg) and a Young’s modulus of approximately above 105°C and 8-9 GPa, respectively, were appropriate for HiCTE FC-CBGA with high lead solder bumps. Conclusion: The result from FEA analysis and ATC reliability test found that the underfill materials with high and medium low Young’s modulus has high reliability in FC-CBGA package.},
journal = {American Journal of Engineering and Applied Sciences},
publisher = {Science Publications}
}