Research in the Improvement of Wettability of Micro-Structure in Patterned Electrodeposition
Li Guangyang, Wang Hong, Yuan Yang, Yao Jinyuan, Yang Zhuoqing and Ding Guifu
DOI : 10.3844/ajnsp.2010.23.31
Current Research in Nanotechnology
Volume 1, Issue 1
Problem statement: The high aspect-ratio electrodeposition was widely used in the manufacture of non-silicon MEMS devices. The wetting of high aspect-ratio micro-structure in electrolyte was important to the uniformity of micro-structure. Approach: In this study, to enhance the wettability of micro-structures in electrolyte, the effect of Sodium Dodecyl Sulfate (SDS) and O2 plasma surface modification were discussed. Contact Angles (CA) between nickel sulfamate and the micro-structure were investigated to test the effect of two ways mentioned above. We employ the plasma photoresist-removal machine to modify micro-structure made of photoresist and the effects of different modification time were also discussed. The mechanism of O2 plasma treatment was investigated. According to Cassie's law, a new method was proposed to follow the wetting progress of micro-structure. Results: The contact angles between the electrolytes with SDS and smooth photoresist surfaces exposed to O2 plasma surface modification decreased from 90-5.2°) continuously. The maximum SDS concentration was 1g L−1 and the longest modification time was 60s. After 30min’s quiescence, the micro-structure was completely filled by electrolyte, with the size of 50×50×50 µm (width×width×height×). Conclusion/Recommendation: It was possible to promote the wettability by introduction of SDS as wetter and the employment of O2 plasma surface modification. The effect of O2 plasma surface modification could be attributed to the introduction of free and associated hydroxyl.
© 2010 Li Guangyang, Wang Hong, Yuan Yang, Yao Jinyuan, Yang Zhuoqing and Ding Guifu. This is an open access article distributed under the terms of the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original author and source are credited.