Comparative Study of Different Underfill Material on Flip Chip Ceramic Ball Grid Array Based on Accelerated Thermal Cycling
Z. Kornain, A. Jalar, N. Amin, R. Rasid and C. S. Foong
DOI : 10.3844/ajeassp.2010.83.89
American Journal of Engineering and Applied Sciences
Volume 3, Issue 1
Problem statement: This study mainly to study the effect of several commercial underfill materials to the reliability of HiCTE Flip Chip Ceramic Ball Grid Array (FC-CBGA) package due to Accelerated Thermal Cycling (ATC) effect. Approach: The warpage condition of package, die back stress, interfacial die shear stress, and solder bump fatigue for different commercial underfills were assessed and compared via a commercial Finite Element Analysis (FEA) under JEDEC Standard of ATC. The thermo-mechanical properties of underfills for simulation were obtained by using Thermal Mechanical Analyzer (TMA) and Dynamic Mechanical Analyzer (DMA). The actual package of HiCTE FC-CBGA were assembled with those underfill materials and underwent ATC to be compared with FEA result. Results: The results from FEA and experimental were discussed to characterize the performance of each underfill material. The results of this study indicate that the underfill materials investigated, those with a glass transition temperature (Tg) and a Young’s modulus of approximately above 105°C and 8-9 GPa, respectively, were appropriate for HiCTE FC-CBGA with high lead solder bumps. Conclusion: The result from FEA analysis and ATC reliability test found that the underfill materials with high and medium low Young’s modulus has high reliability in FC-CBGA package.
© 2010 Z. Kornain, A. Jalar, N. Amin, R. Rasid and C. S. Foong. This is an open access article distributed under the terms of the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original author and source are credited.