Research Article Open Access

Heat Transfer Augmentation for Electronic Cooling

Suabsakul Gururatana1
  • 1 ,
American Journal of Applied Sciences
Volume 9 No. 3, 2012, 436-439

DOI: https://doi.org/10.3844/ajassp.2012.436.439

Published On: 2 February 2012

How to Cite: Gururatana, S. (2012). Heat Transfer Augmentation for Electronic Cooling. American Journal of Applied Sciences, 9(3), 436-439. https://doi.org/10.3844/ajassp.2012.436.439

Abstract

Problem statement: The performance of electronic devices has been improving along with the rapid technology development. Cooling of electronic systems is consequently essential in controlling the component temperature and avoiding any hot spot. The study aims to review the present electronic cooling methods which are widely used in electronic devices. Approach: There are several methods to cool down the electronics components such as the pin-fin heat sink, confined jet impingement, heat pipe, micro heat sink and so on. Results: The cooling techniques can obviously increase heat transfer rate. Nonetheless, for active and passive cooling methods the pressure drop could extremely rise, when the heat transfer rate is increased. Conclusion: When the cooling techniques are used, it is clearly seen that the heat transfer increases with pressure drop. To avoid excessive expense due to high pressure drop, optimization method is required to obtain optimum cost and cooling rate.

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Keywords

  • Rapid development
  • electronics components
  • typical cooling methods
  • heat transfer process
  • Personal Digital Assistant (PDA)
  • designed temperature specifications