Applying Fuzzy Analytic Hierarchy Process and Grey Relation Analysis to Evaluate the Supply Chain Performance of the Wafer Testing House
Yun-Chin Chen, Jun-Yuan Kuo and Bang-Ting Luo
DOI : 10.3844/ajassp.2011.1398.1403
American Journal of Applied Sciences
Volume 8, Issue 12
Problem statement: In the information age, the process of E-Commerce (EC) operates quickly and the present enterprises of Taiwan have to face the Free Cross-Strait Market (FCSM) with Mainland China, which will definitely change the model as well as the performance of the supply chain. Hence, this study focuses on the issue of supply chain performance evaluation of the wafer testing house in Taiwan. Approach: This investigation applied the Fuzzy Analytic Hierarchy Process (FAHP) to derive the weights of influential indicators for evaluating the supply chain performance of the wafer testing house and the Grey Relation Analysis (GRA) was used to evaluate the performance between the FCSM and EC aspects. Results: The analyzed results had identified the indicator weight of the supply chain performance evaluation in the wafer testing house and the indicator performances between different aspects were compared. The research results indicated that the FCSM aspect had better performance than EC aspect of the supply chain evaluation in the wafer testing house. Conclusion/Recommendations: Based on the analyzed results, the managers can find out the problems and improve the supply chain performance of the wafer testing house. This study not only can be a good basis for improvements of the case company, but also can be the reference for evaluating the supply chain performance of the wafer testing house.
© 2011 Yun-Chin Chen, Jun-Yuan Kuo and Bang-Ting Luo. This is an open access article distributed under the terms of the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original author and source are credited.